october 2016 docid029116 rev 2 1 / 10 this is information on a product in full production. www.st.com dsl05 secondary protection for vdsl2 and g.fast lines datasheet - production data features ? high surge capability to comply with gr - 1089 and itu - t k20/21/45 ? keeps peak power capability at high temperature ? voltages: 8, 12 and 24 v ? low capacitance device: c typ = 0.95 pf ? rohs package ? low leakage current: 50 na at 25 c complies with the following standards re fer to figure 7 and figure 8 . ? telcordia gr - 1089 ? 2.5 kv 2/10 s - 500 a 2/10 s ? ac power fault tests ? itu - t k20/21/45 ? 6 kv 10/700 s - 150 a 5/310 s ? power induction and contact tests ? iec 6100 0 - 4 - 2, level 4 ? 15 kv (air discharge) ? 8 kv (contact discharge) ? iec 61000 - 4 - 5, level 2 ? 1 kv, 42 ? mil std 883g - method 3015 - 7: class 3 ? 8 kv (human body model) description dsl05 is designed to protect dsl line drivers against surges defined in worldwide telecommunication standards. this device protects line drivers of various systems such as xdsl and g.fast. the low capacitance makes it suitable from adsl to g.fast data rate s. dsl05 is able to survive severe conditions even when used with downgraded or oscillating gas tube. this device is packaged in a sot23 - 6l. figure 1 : functional diagram table 1: device summary order code v rm (v) dsl05 - 008sc6 8 dsl05 - 012sc6 12 dsl05 - 024sc6 24 n c + v l d n c i / o 1 - v l d i / o 2 s o t 2 3 - 6 l
characteristics dsl05 2 / 10 docid029116 rev 2 1 characteristics table 2: absolute ratings (t amb = - 40 to 85 c) symbol parameter value unit i pp peak pulse current 8/20s 30 a dl/dt critical rate of on - state current rise 1000 a/s t stg storage junction temperature range - 55 to +150 c t j maximum operating junction temperature t l maximum temperature for soldering during 10 s 260 c table 3: electrical characteristics (t amb = 25 c, pin 1 to pin 3) order code i rm at v rm v br at 1 ma v bo ih c (1) c (2) typ. max. typ. max. min. max. typ. max. typ. t amb = 85 c na v v v ma pf pf dsl05 - 008sc6 3 100 10 200 8 9.5 15 50 1.5 0.25 dsl05 - 012sc6 3 100 10 200 12 12.8 18 50 1.5 0.25 dsl05 - 024sc6 0.1 50 7 100 24 25.5 31 50 1.5 0.25 notes: (1) test conditions: v r = 2 v bias, v rms = 1 v, f = 1 mhz (2) measured between 1 v and v rm figure 2 : electrical characteristics definitions
dsl05 characteristics docid029116 rev 2 3 / 10 1.1 characteristics (curves) figure 3 : peak pulse power dissipation versus initial junction temperature (maximum values) figure 4 : leakage current versus junction temperature figure 5 : junction capacitance versus reverse voltage figure 6 : junction capacitance versus junction temperature figure 7 : clamping response to 8/20 s surge (i pp = 10 a) 0 1 0 2 0 3 0 4 0 5 0 0 2 5 5 0 7 5 1 0 0 1 2 5 1 5 0 1 7 5 i p p ( a ) t j ( c ) 8 / 2 0 s 0 . 6 0 . 7 0 . 8 0 . 9 1 . 0 1 . 1 1 . 2 1 . 3 1 . 4 1 . 5 1 . 6 0 2 5 5 0 7 5 1 0 0 1 2 5 1 5 0 c ( p f ) t j ( c ) v o s c = 1 v v r = 2 v i / o t o i / o 0 . 0 1 0 . 1 1 1 0 1 0 0 1 0 0 0 1 0 0 0 0 0 2 5 5 0 7 5 1 0 0 1 2 5 1 5 0 t j ( c ) d s l 0 5 - 0 0 8 s c 6 d s l 0 5 - 0 2 4 s c 6 i r ( n a ) 0 0 . 5 1 1 . 5 2 2 . 5 3 0 2 4 6 8 1 0 1 2 1 4 1 6 1 8 2 0 2 2 2 4 v r ( v ) t j = 2 5 c v o s c = 1 v v r < v r m i / o t o i / o c ( p f )
schematics dsl05 4 / 10 docid029116 rev 2 2 schematics figure 8 : xdsl and g.fast schematic for cpe applications figure 9 : xdsl and g.fast schematic for infrastructure applications v l d - v l d + v l d - v l d + v l d - v l d + v l d - v l d +
dsl05 package information docid029116 rev 2 5 / 10 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. ? epoxy meets ul 94,v0 ? lead - free package 3.1 sot23 - 6l package information figure 10 : sot23 - 6l package outline table 4: sot23 - 6l package mechanical data ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.9 1.45 0.0354 0.0571 a1 0 0.15 0 0.0059 a2 0.9 1.3 0.0354 0.0512 b 0.30 0.5 0.0118 0.0197 c 0.09 0.2 0.0035 0.0079 d 2.8 3.05 0.1102 0.1201 e 1.5 1.75 0.0591 0.0689 e 0.95 0.0374 h 2.6 3 0.1024 0.1181 l 0.3 0.6 0.0118 0.0236 0 10 0 0.3937
package information dsl05 6 / 10 docid029116 rev 2 figure 11 : footprint recommendations, dimensions in mm (inches) figure 12 : marking layout (refer to ordering information table for marking) figure 13 : package orientation in reel f igure 14 : tape and reel orientation figure 15 : reel dimensions (mm) figure 16 : inner box dimensions (mm)
dsl05 package information docid029116 rev 2 7 / 10 figure 17 : tape and reel outline table 5: tape and reel mechanical data ref. dimensions millimeters min. typ. max. p1 3.9 4 4.1 p0 3.9 4 4.1 d0 1.45 1.5 1.6 d1 1 f 3.45 3.5 3.55 k0 1.3 1.4 1.6 p2 1.95 2 2.05 w 7.9 8 8.3
package information dsl05 8 / 10 docid029116 rev 2 figure 18 : st ecopack ? recommended soldering reflow profile for pcb mounting minimize air convection currents in the reflow oven to avoid component movement. maximum soldering profile corresponds to the latest ipc/jedec j - std - 020.
dsl05 ordering information docid029116 rev 2 9 / 10 4 ordering information figure 19 : ordering information scheme table 6: ordering information order code marking package weight base qty. delivery mode dsl05 - 008sc6 d508 sot23 - 6l 14 g 3000 tape and reel dsl05 - 012sc6 d512 dsl05 - 024sc6 d524 5 revision history table 7: document revision history date revision changes 05 - jul - 2016 1 initial release. 03 - oct - 2016 2 updated table 3: "electrical characteristics (tamb = 25 c, pin 1 to pin 3)" . d s l 0 x - v v v s c 6 d s l p r o t e c t i o n v e r s i o n s t a n d - o f f v o l t a g e p a c k a g e 0 2 4 = 2 4 v s c 6 = s o t 2 3 - 6 l
dsl05 10 / 10 docid029116 rev 2 important notice C please read carefully stmicroelectronics nv and its subsidiaries (st) reserve the right to make changes, corrections, enhancements, modifications , and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant information on st products before placing orders. st products are sold pursuant to sts terms and conditions of sale in place at the time of or der acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and s t assumes no liability for application assistance or the design of purchasers products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information se t forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2016 stmicroelectronics C all rights reserved
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